Mô tả
Features
1. ESD safe design.
2. PID controlled closed loop of sensor, rapid heating, precise and stable temperature.
3. Suitable for soldering and de-soldering surface mounted ICs, such as QFP, PLCC, SOP, BGA etc.
4. Intelligent cooling system, deferred air delivery when unit is off, auto power off when temperature drops below 100℃.
5. Imported heating wire has long service life.
6. Low vibration, free noise
Specifications
| Power consumption | 320W |
| Temperature range | 100℃-480℃ |
| Air volume | ≤24L/min |
| Pump | diaphragm |
| Dimensions | 187(L)*135(W)*245(H)mm |
| Weight | About 4kg |
Replaceable Nozzles
