Mô tả
Features
1. Combined working plate, easier for equipment maintenance.
2. Heating upward and downward simultaneously, suitable for de-soldering BGA and other chips which need preheating.
3. Adjustable according to different sizes of PCBs.
4. Picking up and placing chips function can be selected as per requirements.
Specifications
| Dimensions of bottom board | 350(L)*250(W)mm |
| Height | 380mm |
| Fine adjustment height | 60mm |
| Large PCB Holder | 382(L)*300(W)*110(H)mm |
| Small PCB Holder | 216(L)*180(W)*82(H)mm |
| Weight | About 5.6kg |
